Core Features
High-Frequency Optimized Design
Contacts are made of high‑purity oxygen‑free copper with gold plating, delivering contact resistance below 3mΩ and insertion/extraction life of ≥10,000 cycles. Insulation dielectric uses LCP material with impedance precisely controlled at 50Ω. Insertion loss ≤0.3dB@25GHz, return loss ≤‑20dB@25GHz, fully compatible with DDR5 6400MT/s and higher speeds.
Structural & Safety Design
Vertical type with self‑locking latch prevents loosening and reverse insertion. Horizontal SMT type has an ultra‑low profile of only 5.2mm to save vertical space. Selected models support hot‑swap and ESD protection (≥±8kV), suitable for industrial vibration and dusty environments.
Installation & Compatibility
Pinout compatible with Altium / Cadence component libraries, supporting SMT or through‑hole soldering for automated production lines. Housing uses UL94 V‑0 flame‑retardant material, operating temperature range ‑40℃~125℃, ideal for servers, industrial control and other harsh conditions.
Product Advantages
High-Speed Compatibility
Meets JEDEC DDR4/DDR5 specifications, supports PCIe 4.0/5.0 and ECC memory. Clear eye diagram without distortion ensures stable data transmission.
High Reliability & Durability
Locking and contact structure resists vibration; wide temperature tolerance and high mass‑production consistency. Suitable for 24/7 operating servers and industrial equipment.
Standardized & Interchangeable
Dimensions and pin pitch comply with international standards, compatible with mainstream memory modules and board designs, resulting in low replacement costs.
Flexible Customization
Customizable pin length, housing color and locating holes. Wide‑temperature (‑55℃~150℃) and IP65 waterproof versions available. Standard custom samples delivered within 2 working days with controllable mass production lead times.
Applications
Servers & Data Centers: For rack / blade servers, supporting high‑speed massive data transmission in cloud computing and big data analytics.
Industrial Control: Used in embedded hosts and PLC mainboards for high‑speed sensor data acquisition and processing in smart manufacturing.
Consumer Electronics: Laptops, desktops and high‑end gaming consoles to improve memory read/write speed and system responsiveness.
Edge Computing: Industrial tablets and vehicle‑mounted control modules for space‑constrained and high‑vibration environments.
Selection & FAQs
Key Selection Parameters
Memory type (DDR4/DDR5) and module type (UDIMM/SODIMM)
Mounting style (vertical / horizontal), pin count and PCB thickness
Speed requirement (e.g. DDR5 5200/6400MT/s) and ESD / protection level
Operating temperature, vibration intensity and environmental conditions
FAQ
Q: Can DDR4 and DDR5 sockets be interchanged?
A: No. Pin definitions and latch positions differ, with anti‑misinsertion design to prevent wrong insertion.
Q: What is the profile and pitch of horizontal SODIMM sockets?
A: Typical height 5.2mm, pin pitch 0.5mm, designed for compact modules.
Q: Are long pins or special locating holes customizable?
A: Yes. Pin length, locating holes and housing color can be adjusted to meet non‑standard board designs
